Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8956892 | Method and apparatus for fabricating a light-emitting diode package | Kui Kam Lam, Ka Yee Mak, Ming-Yang Li | 2015-02-17 |
| 7977231 | Die bonder incorporating dual-head dispenser | Kui Kam Lam, Yen Hsi Tang, Hok Man WAN | 2011-07-12 |