Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9989587 | Apparatus for testing multiple semiconductor dice with increased throughput | Kui Kam Lam, Kai Siu LAM, Ka Wai Paul Chan | 2018-06-05 |
| 8919631 | Wire bonder including a transducer, a bond head, and a mounting apparatus | Ka Shing Kenny Kwan, Hing Leung Li, Xiang Li | 2014-12-30 |
| 7997470 | Flanged transducer having improved rigidity | Hing Leung Li, Boon June Yeap, Ka Shing Kenny Kwan, Man Chan | 2011-08-16 |
| 7954689 | Vacuum wire tensioner for wire bonder | Ka Shing Kenny Kwan, Yue ZHANG | 2011-06-07 |
| 7780064 | Wire bonding method for forming low-loop profiles | Mow Huat GOH | 2010-08-24 |
| 7677431 | Electronic device handler for a bonding apparatus | Keng Yew SONG, Ka Shing Kenny Kwan | 2010-03-16 |
| 7628307 | Apparatus for delivering shielding gas during wire bonding | Ka Shing Kenny Kwan | 2009-12-08 |
| 7568606 | Electronic device handler for a bonding apparatus | Keng Yew SONG, Ka Shing Kenny Kwan | 2009-08-04 |
| 7494042 | Method of forming low wire loops and wire loops formed using the method | Yi Bin Wang, Wei Liu | 2009-02-24 |
| 7314157 | Wire bond with improved shear strength | — | 2008-01-01 |
| 7303109 | Stud bumping apparatus | Ka Shing Kenny Kwan, Guoshen Hu, Tingyu He, Yie Mi | 2007-12-04 |
| 7214606 | Method of fabricating a wire bond with multiple stitch bonds | Chee Wai Siew, Wei Liu, Zuo Cheng Shen | 2007-05-08 |
| 7100812 | Capillary holder | Bao Nian Zhai, Ka Shing Kenny Kwan, Man Chan, Chi Po Chong, Hing Leung Li | 2006-09-05 |
| 7064433 | Multiple-ball wire bonds | Jin Siong Joshua Soh | 2006-06-20 |
| 7025243 | Bondhead for wire bonding apparatus | Ka Shing Kenny Kwan, Chong Chen | 2006-04-11 |
| 6866182 | Apparatus and method to prevent oxidation of electronic devices | Ka Shing Kenny Kwan, Rong Duan, Zhao Rui | 2005-03-15 |
| 6827247 | Apparatus for detecting the oscillation amplitude of an oscillating object | Liming Fan, Hon Yu Peter Ng, Xianbin Zhu, Keng Yew SONG | 2004-12-07 |
| 6749100 | Multiple-head wire-bonding system | Keng Yew SONG, Ka Shing Kenny Kwan, Hon Yu Peter Ng, Tin Kwan Bobby Chan | 2004-06-15 |
| 6672503 | Method of bonding wires | Siu Wing Or, Honghai Zhu, Honyu Ng | 2004-01-06 |
| 6660956 | Method of and apparatus for monitoring a ball forming process | Michael Armin Boller, Baskaran Annamalai, Honghai Zhu | 2003-12-09 |
| 6572001 | Bonding system | Keng Yew SONG | 2003-06-03 |