Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543362 | Method for measuring the heights of wire interconnections | Keng Yew SONG, Chi Kwan Park, Jiang Huang, Ya Ping Zhu | 2023-01-03 |
| 11145620 | Formation of bonding wire vertical interconnects | Jiang Huang, Ya Ping Zhu, Chi Kwan Park, Keng Yew SONG | 2021-10-12 |
| 7780064 | Wire bonding method for forming low-loop profiles | Yam Mo Wong | 2010-08-24 |