Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543362 | Method for measuring the heights of wire interconnections | Chi Kwan Park, Jiang Huang, Ya Ping Zhu, Mow Huat GOH | 2023-01-03 |
| 11400495 | Automated particle removal system having angular adjustability | Chin Tiong Ong, Soo Kin (Kenny) Tan, Qing Le Tan, Gang Shu | 2022-08-02 |
| 11289446 | Multiple actuator wire bonding apparatus | Yue ZHANG, Xiao Liang Chen, Zheng Yu Lin | 2022-03-29 |
| 11239197 | Wire bonding apparatus threading system | Yue ZHANG, Xiao Liang Chen, Yao TONG | 2022-02-01 |
| 11227779 | Apparatus and method for processing a semiconductor device | Jiapei DING, Kar Weng Yan, Teng Hock Kuah, Jian Liao, Bin Yuan +1 more | 2022-01-18 |
| 11205634 | Bonding apparatus with replaceable bonding tool | Yue ZHANG, Xiao Liang Chen | 2021-12-21 |
| 11205937 | Driving system having reduced vibration transmission | Ka Shing Kenny Kwan, Yue ZHANG, Xiao Liang Chen, Chu Fan Feng | 2021-12-21 |
| 11145620 | Formation of bonding wire vertical interconnects | Mow Huat GOH, Jiang Huang, Ya Ping Zhu, Chi Kwan Park | 2021-10-12 |
| 11017996 | Automated particle removal system | Gang Shu, Chin Tiong Ong, Qing Le Tan | 2021-05-25 |
| 10163845 | Method and apparatus for measuring a free air ball size during wire bonding | Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan | 2018-12-25 |
| 9889521 | Method and system for pull testing of wire bonds | Yi Bin Wang, Qing Le Tan, Lin Zheng, Jia Le Luo | 2018-02-13 |
| 9881891 | Method of forming three-dimensional wire loops and wire loops formed using the method | Jeffrey Grijaldo, Jung Min Kim, Joon Ho Lee, Chi Kwan Park | 2018-01-30 |
| 9640512 | Wire bonding apparatus comprising an oscillator mechanism | Ka Shing Kenny Kwan, Yue ZHANG, Yan Sun, Xiao Liang Chen | 2017-05-02 |
| 9620477 | Wire bonder and method of calibrating a wire bonder | Wai Wah Lee, Yi Bin Wang | 2017-04-11 |
| 9502374 | Automatic wire tail adjustment system for wire bonders | Wai Wah Lee, Yi Bin Wang, Wen Hua Guo, Xin Zhang | 2016-11-22 |
| 8707550 | Bonding machine incorporating dual-track transfer mechanism | Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting He | 2014-04-29 |
| 8459530 | Automatic wire feeding method for wire bonders | Yue ZHANG, Xiao Liang Chen | 2013-06-11 |
| 8186562 | Apparatus for increasing coverage of shielding gas during wire bonding | Ka Shing Kenny Kwan, Boon June Yeap, Shi-Jie Chen, Sathish Kumar Balakrishnan, Kumaresh GOVINDAN RADHAKRISHNAN | 2012-05-29 |
| 7677431 | Electronic device handler for a bonding apparatus | Yam Mo Wong, Ka Shing Kenny Kwan | 2010-03-16 |
| 7568606 | Electronic device handler for a bonding apparatus | Yam Mo Wong, Ka Shing Kenny Kwan | 2009-08-04 |
| 6827247 | Apparatus for detecting the oscillation amplitude of an oscillating object | Liming Fan, Hon Yu Peter Ng, Xianbin Zhu, Yam Mo Wong | 2004-12-07 |
| 6749100 | Multiple-head wire-bonding system | Yam Mo Wong, Ka Shing Kenny Kwan, Hon Yu Peter Ng, Tin Kwan Bobby Chan | 2004-06-15 |
| 6572001 | Bonding system | Yam Mo Wong | 2003-06-03 |
| 6568581 | Detection of wire bonding failures | Michael Armin Boller, Baskaran Annamalai | 2003-05-27 |