Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543362 | Method for measuring the heights of wire interconnections | Keng Yew SONG, Chi Kwan Park, Jiang Huang, Mow Huat GOH | 2023-01-03 |
| 11145620 | Formation of bonding wire vertical interconnects | Mow Huat GOH, Jiang Huang, Chi Kwan Park, Keng Yew SONG | 2021-10-12 |