Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543362 | Method for measuring the heights of wire interconnections | Keng Yew SONG, Jiang Huang, Ya Ping Zhu, Mow Huat GOH | 2023-01-03 |
| 11145620 | Formation of bonding wire vertical interconnects | Mow Huat GOH, Jiang Huang, Ya Ping Zhu, Keng Yew SONG | 2021-10-12 |
| 9881891 | Method of forming three-dimensional wire loops and wire loops formed using the method | Jeffrey Grijaldo, Jung Min Kim, Joon Ho Lee, Keng Yew SONG | 2018-01-30 |