Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Teng Hock Kuah, Yi Lin, Ravindra RAGHAVENDRA, Angelito Barrozo Perez | 2024-04-09 |
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Rolan Ocuaman Camba, Teng Hock Kuah, Jian Liao | 2023-06-13 |
| 11621181 | Dual-sided molding for encapsulating electronic devices | Teng Hock Kuah, Yi Lin, Perez Angelito Barrozo | 2023-04-04 |
| 11227779 | Apparatus and method for processing a semiconductor device | Jiapei DING, Teng Hock Kuah, Jian Liao, Keng Yew SONG, Bin Yuan +1 more | 2022-01-18 |
| 8794952 | Apparatus for molding electronic components | Shu Chuen Ho, Si Liang Lu, Swee Kwong Mok | 2014-08-05 |
| 8292613 | Runner system for supplying molding compound | Shu Chuen Ho, Si Liang Lu, Swee Kwong Mok | 2012-10-23 |