Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Teng Hock Kuah, Ravindra RAGHAVENDRA, Kar Weng Yan, Angelito Barrozo Perez | 2024-04-09 |
| 11621181 | Dual-sided molding for encapsulating electronic devices | Teng Hock Kuah, Kar Weng Yan, Perez Angelito Barrozo | 2023-04-04 |