Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Teng Hock Kuah, Yi Lin, Kar Weng Yan, Angelito Barrozo Perez | 2024-04-09 |
| 9427893 | Molding press and a platen for a molding press | Jian Xiong SU, Teng Hock Kuah, Shu Chuen Ho, Jiapei DING | 2016-08-30 |
| 9279185 | Feed-through apparatus for a chemical vapour deposition device | Zilan Li, Teng Hock Kuah, Chidambaram Palaniappan | 2016-03-08 |
| 8840726 | Apparatus for thin-film deposition | Zilan Li, Teng Hock Kuah, Jiapei DING | 2014-09-23 |