Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Yi Lin, Ravindra RAGHAVENDRA, Kar Weng Yan, Angelito Barrozo Perez | 2024-04-09 |
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Rolan Ocuaman Camba, Jian Liao, Kar Weng Yan | 2023-06-13 |
| 11621181 | Dual-sided molding for encapsulating electronic devices | Yi Lin, Kar Weng Yan, Perez Angelito Barrozo | 2023-04-04 |
| 11548273 | Apparatus and method for removing a film from a surface | Ji Hao, Patrocinio Jr Go Torres, Kai WU, Moung Kai Kong | 2023-01-10 |
| 11227779 | Apparatus and method for processing a semiconductor device | Jiapei DING, Kar Weng Yan, Jian Liao, Keng Yew SONG, Bin Yuan +1 more | 2022-01-18 |
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Shu Chuen Ho, Choon Hong Cheong, Chin Guan Ong, Kai WU, Ji Hao | 2021-03-30 |
| 10115579 | Method for manufacturing wafer-level semiconductor packages | Chun Ho Fan | 2018-10-30 |
| 9947561 | Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump | Chee Toh Teh, Shu Chuen Ho, Kai WU, Chin Chong Lee | 2018-04-17 |
| 9427893 | Molding press and a platen for a molding press | Jian Xiong SU, Shu Chuen Ho, Jiapei DING, Ravindra RAGHAVENDRA | 2016-08-30 |
| 9346205 | Optical device molding system | Shu Chuen Ho, Ji Hao, Ee Ling Chiw, See Yap Ong | 2016-05-24 |
| 9279185 | Feed-through apparatus for a chemical vapour deposition device | Zilan Li, Chidambaram Palaniappan, Ravindra RAGHAVENDRA | 2016-03-08 |
| 9199396 | Substrate carrier for molding electronic devices | See Yap Ong, Ji Hao, Kai WU, Ee Ling Chiw | 2015-12-01 |
| 8840726 | Apparatus for thin-film deposition | Zilan Li, Jiapei DING, Ravindra RAGHAVENDRA | 2014-09-23 |
| 8011917 | Compression molding of an electronic device | Ji Hao, See Yap Ong, Jian Xiong SU, Ee Ling Chiw | 2011-09-06 |
| 7927087 | Method and apparatus for molding with reduced cull formation | Xiang Chen, Shu Chuen Ho, Si Liang Lu, See Yap Ong | 2011-04-19 |
| 7618249 | Memory card molding apparatus and process | Lap Yu Chan, Chun Li, Si Liang Lu | 2009-11-17 |
| 7241414 | Method and apparatus for molding a semiconductor device | Shu Chuen Ho, Zhi-Ping Zhang, Shuai Lee, Chun Li, Yi-Sheng Lin | 2007-07-10 |
| 6988879 | Apparatus and method for reducing substrate warpage | Shu Chuen Ho, Kock Wee, Jian Wu | 2006-01-24 |
| 6986197 | Method of manufacturing an IC package | Jian Wu, Yan Zhou, Shu Chuen Ho | 2006-01-17 |
| 6877933 | Pellet feeding system for a molding machine | Shu Chuen Ho, Jie Liu | 2005-04-12 |
| 6869556 | Molding system for semiconductor packages | Shu Chuen Ho, Jian Wu, Si Liang Lu | 2005-03-22 |
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani | 2005-03-01 |
| 6808661 | Method for encapsulating leadframe-mounted integrated circuits | See Yap Ong, Kock Wee, Shu Chuen Ho, Jian Wu | 2004-10-26 |
| 6770163 | Mold and method for encapsulation of electronic device | Shu Chuen Ho, Charles Vath, Loon Lim, Man Ho Hui, Juay Sim Koh | 2004-08-03 |
| 6752896 | Method of detaching a film of material from a substrate | See Yap Ong, Keng Hock Chew, Shu Chuen Ho | 2004-06-22 |