Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8794952 | Apparatus for molding electronic components | Shu Chuen Ho, Swee Kwong Mok, Kar Weng Yan | 2014-08-05 |
| 8292613 | Runner system for supplying molding compound | Shu Chuen Ho, Swee Kwong Mok, Kar Weng Yan | 2012-10-23 |
| 7927087 | Method and apparatus for molding with reduced cull formation | Xiang Chen, Shu Chuen Ho, Teng Hock Kuah, See Yap Ong | 2011-04-19 |
| 7695269 | Apparatus and method for in-mold degating | See Yap Ong, Zheng Gao, Swee Huat Lee | 2010-04-13 |
| 7618249 | Memory card molding apparatus and process | Lap Yu Chan, Chun Li, Teng Hock Kuah | 2009-11-17 |
| 6869556 | Molding system for semiconductor packages | Shu Chuen Ho, Teng Hock Kuah, Jian Wu | 2005-03-22 |
| 6709252 | Molding apparatus | Jie Liu, Shu Chuen Ho, Man Ho Hui, Teng Hock Kuah | 2004-03-23 |
| 6674165 | Mold for a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Srikanth Narasimulau, Charles Vath | 2004-01-06 |