Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Choon Hong Cheong, Chin Guan Ong, Kai WU, Teng Hock Kuah, Ji Hao | 2021-03-30 |
| 9947561 | Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump | Teng Hock Kuah, Chee Toh Teh, Kai WU, Chin Chong Lee | 2018-04-17 |
| 9487881 | Apparatus for electroplating a tooling for use in semiconductor device encapsulation | Kai Fat Yip, Eng Cheng Chng, Yew Lan Ngo, Saravana Ranganathan Damodaran | 2016-11-08 |
| 9427893 | Molding press and a platen for a molding press | Jian Xiong SU, Teng Hock Kuah, Jiapei DING, Ravindra RAGHAVENDRA | 2016-08-30 |
| 9346205 | Optical device molding system | Teng Hock Kuah, Ji Hao, Ee Ling Chiw, See Yap Ong | 2016-05-24 |
| 8794952 | Apparatus for molding electronic components | Si Liang Lu, Swee Kwong Mok, Kar Weng Yan | 2014-08-05 |
| 8419404 | Modular molding assembly for electronic devices | Jian Wu, Choon Hong Cheong, Chee Toh Teh, Fu Sun Huang | 2013-04-16 |
| 8292613 | Runner system for supplying molding compound | Si Liang Lu, Swee Kwong Mok, Kar Weng Yan | 2012-10-23 |
| 7927087 | Method and apparatus for molding with reduced cull formation | Xiang Chen, Teng Hock Kuah, Si Liang Lu, See Yap Ong | 2011-04-19 |
| 7901196 | Molding apparatus incorporating pressure uniformity adjustment | Srikanth Narasimalu, Sathish Kumar Balakrishnan, Ning Ying | 2011-03-08 |
| 7829004 | Transfer molding method and system for electronic devices | Jian Wu, Lap Yu Chan | 2010-11-09 |
| 7677874 | Vacuum molding apparatus | Zheng Gao | 2010-03-16 |
| 7241414 | Method and apparatus for molding a semiconductor device | Teng Hock Kuah, Zhi-Ping Zhang, Shuai Lee, Chun Li, Yi-Sheng Lin | 2007-07-10 |
| 7030504 | Sectional molding system | Jie Liu, See Yap Ong | 2006-04-18 |
| 6988879 | Apparatus and method for reducing substrate warpage | Teng Hock Kuah, Kock Wee, Jian Wu | 2006-01-24 |
| 6986197 | Method of manufacturing an IC package | Jian Wu, Yan Zhou, Teng Hock Kuah | 2006-01-17 |
| 6877933 | Pellet feeding system for a molding machine | Teng Hock Kuah, Jie Liu | 2005-04-12 |
| 6869556 | Molding system for semiconductor packages | Teng Hock Kuah, Jian Wu, Si Liang Lu | 2005-03-22 |
| 6860731 | Mold for encapsulating a semiconductor chip | Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani | 2005-03-01 |
| 6808661 | Method for encapsulating leadframe-mounted integrated circuits | See Yap Ong, Kock Wee, Teng Hock Kuah, Jian Wu | 2004-10-26 |
| 6770163 | Mold and method for encapsulation of electronic device | Teng Hock Kuah, Charles Vath, Loon Lim, Man Ho Hui, Juay Sim Koh | 2004-08-03 |
| 6752896 | Method of detaching a film of material from a substrate | See Yap Ong, Keng Hock Chew, Teng Hock Kuah | 2004-06-22 |
| 6736627 | Mold cleaning apparatus | Jie Liu, Zhen Rong Huang, Chin Guan Ong, Teng Hock Kuah | 2004-05-18 |
| 6709252 | Molding apparatus | Jie Liu, Si Liang Lu, Man Ho Hui, Teng Hock Kuah | 2004-03-23 |
| 6674165 | Mold for a semiconductor chip | Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles Vath | 2004-01-06 |