Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Shu Chuen Ho, Chin Guan Ong, Kai WU, Teng Hock Kuah, Ji Hao | 2021-03-30 |
| 8419404 | Modular molding assembly for electronic devices | Shu Chuen Ho, Jian Wu, Chee Toh Teh, Fu Sun Huang | 2013-04-16 |