Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947561 | Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump | Teng Hock Kuah, Shu Chuen Ho, Kai WU, Chin Chong Lee | 2018-04-17 |
| 8419404 | Modular molding assembly for electronic devices | Shu Chuen Ho, Jian Wu, Choon Hong Cheong, Fu Sun Huang | 2013-04-16 |