Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Shu Chuen Ho, Choon Hong Cheong, Kai WU, Teng Hock Kuah, Ji Hao | 2021-03-30 |
| 6736627 | Mold cleaning apparatus | Jie Liu, Zhen Rong Huang, Shu Chuen Ho, Teng Hock Kuah | 2004-05-18 |