Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7427009 | Capillary for wire bonding | Charles Vath | 2008-09-23 |
| 6770163 | Mold and method for encapsulation of electronic device | Teng Hock Kuah, Shu Chuen Ho, Charles Vath, Man Ho Hui, Juay Sim Koh | 2004-08-03 |