Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Srikanth Narasimulau, Murali Sarangapani | 2005-03-01 |
| 6770163 | Mold and method for encapsulation of electronic device | Teng Hock Kuah, Shu Chuen Ho, Charles Vath, Loon Lim, Juay Sim Koh | 2004-08-03 |
| 6709252 | Molding apparatus | Jie Liu, Si Liang Lu, Shu Chuen Ho, Teng Hock Kuah | 2004-03-23 |