Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404598 | Coated wire | Yee Weon Lim, Wai Khee See Tho, Mariyappan DHAYALAN, Chee Chow TAN, Juergen SCHARF +1 more | 2025-09-02 |
| 12305306 | Coated round wire | Miew Wan LO, Yong Wang | 2025-05-20 |
| 12084784 | Coated wire | Miew Wan LO | 2024-09-10 |
| 11791309 | Process for electrically connecting contact surfaces of electronic components | Yean Mee Pun, Xi Zhang, Il Tae Kang, Abito Danila BAYARAS, Kim Hui Chong +3 more | 2023-10-17 |
| 11236430 | Coated wire | Yee Weon Lim, Xi Zhang, Senthil Balasubramanian, Suat Teng Tan, Jin Zhi Liao +3 more | 2022-02-01 |
| 10960498 | Coated wire | Il Tae Kang, Yong-Deok TARK, Mong Hyun Cho, Jong Su Kim, Hyun Seok Jung +2 more | 2021-03-30 |
| 9589694 | Alloyed 2N copper wires for bonding in microelectronics devices | Ping Ha YEUNG, Eugen MILKE | 2017-03-07 |
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau | 2005-03-01 |