Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Murali Sarangapani | 2005-03-01 |
| 6674165 | Mold for a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Charles Vath | 2004-01-06 |