Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7427009 | Capillary for wire bonding | Loon Lim | 2008-09-23 |
| 6770163 | Mold and method for encapsulation of electronic device | Teng Hock Kuah, Shu Chuen Ho, Loon Lim, Man Ho Hui, Juay Sim Koh | 2004-08-03 |
| 6674165 | Mold for a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau | 2004-01-06 |