Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6988879 | Apparatus and method for reducing substrate warpage | Shu Chuen Ho, Teng Hock Kuah, Jian Wu | 2006-01-24 |
| 6808661 | Method for encapsulating leadframe-mounted integrated circuits | See Yap Ong, Shu Chuen Ho, Teng Hock Kuah, Jian Wu | 2004-10-26 |