Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392390 | Apparatus and method for vibration attenuation | Jinchun Huang, Zhenyong Bai, Huawei Guan, Ping Kong Choy | 2025-08-19 |
| 12072251 | Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device | Ajit Gaunekar, Zhi Tao Wang | 2024-08-27 |
| 11559823 | Volumetric measurement and regulation device incorporated in a time-pressure dispenser | Kuok Hang MAK, Tsz Kit YU, Chun-Ting Lau, Wai Keung Tam | 2023-01-24 |
| 11205937 | Driving system having reduced vibration transmission | Keng Yew SONG, Yue ZHANG, Xiao Liang Chen, Chu Fan Feng | 2021-12-21 |
| 9640512 | Wire bonding apparatus comprising an oscillator mechanism | Keng Yew SONG, Yue ZHANG, Yan Sun, Xiao Liang Chen | 2017-05-02 |
| 9254641 | Screen printer, and method of cleaning a stencil of a screen printer | See Yap Ong, Kun Fan | 2016-02-09 |
| 9070762 | Lead frame support plate and window clamp for wire bonding machines | Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ting He +1 more | 2015-06-30 |
| 8919631 | Wire bonder including a transducer, a bond head, and a mounting apparatus | Yam Mo Wong, Hing Leung Li, Xiang Li | 2014-12-30 |
| 8752751 | Lead frame support plate and window clamp for wire bonding machines | Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ting He +1 more | 2014-06-17 |
| 8707550 | Bonding machine incorporating dual-track transfer mechanism | Keng Yew SONG, Choong Kead Leslie Lum, Ting He | 2014-04-29 |
| 8256658 | Wire bonding apparatus comprising rotary positioning stage | Gang Ou, Ajit Gaunekar, Dongsheng Zhang | 2012-09-04 |
| 8186562 | Apparatus for increasing coverage of shielding gas during wire bonding | Keng Yew SONG, Boon June Yeap, Shi-Jie Chen, Sathish Kumar Balakrishnan, Kumaresh GOVINDAN RADHAKRISHNAN | 2012-05-29 |
| 7997470 | Flanged transducer having improved rigidity | Hing Leung Li, Boon June Yeap, Man Chan, Yam Mo Wong | 2011-08-16 |
| 7954689 | Vacuum wire tensioner for wire bonder | Yue ZHANG, Yam Mo Wong | 2011-06-07 |
| 7766211 | Temperature control of a bonding stage | Gang Ou, Yong Wang, Man Chan | 2010-08-03 |
| 7681775 | Multi-layer thermal insulation for a bonding system | Man Chan | 2010-03-23 |
| 7677431 | Electronic device handler for a bonding apparatus | Yam Mo Wong, Keng Yew SONG | 2010-03-16 |
| 7628307 | Apparatus for delivering shielding gas during wire bonding | Yam Mo Wong | 2009-12-08 |
| 7614540 | Thermal insulation for a bonding tool | Boon June Yeap | 2009-11-10 |
| 7568606 | Electronic device handler for a bonding apparatus | Yam Mo Wong, Keng Yew SONG | 2009-08-04 |
| 7549569 | Wire clamp gap control mechanism and method | Chong Chen, Gang Ou | 2009-06-23 |
| 7532428 | Soft touch clamp actuation mechanism | Tingyu He | 2009-05-12 |
| 7306082 | Passive damping of vibrations in a support structure | Srikanth Narasimalu, Murali Saranagapani, Sathish Kumar Balakrishnan | 2007-12-11 |
| 7303109 | Stud bumping apparatus | Guoshen Hu, Tingyu He, Yie Mi, Yam Mo Wong | 2007-12-04 |
| 7303110 | Flange-mounted transducer | Bao Nian Zhai | 2007-12-04 |