HL

Hing Leung Li

AA Asm Assembly Automation: 4 patents #23 of 182Top 15%
AP Asm Technology Singapore Pte: 3 patents #47 of 338Top 15%
AP Asmpt Singapore Pte.: 1 patents #14 of 77Top 20%
HU Hong Kong Polytechnic University: 1 patents #243 of 733Top 35%
HT Hong Kong University Of Science And Technology: 1 patents #320 of 964Top 35%
Overall (All Time): #496,991 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11798911 Force sensor in an ultrasonic wire bonding device Hoi Ting LAM, Tsz Kit YU, Ly Tat Peh 2023-10-24
8919631 Wire bonder including a transducer, a bond head, and a mounting apparatus Yam Mo Wong, Ka Shing Kenny Kwan, Xiang Li 2014-12-30
7997470 Flanged transducer having improved rigidity Boon June Yeap, Ka Shing Kenny Kwan, Man Chan, Yam Mo Wong 2011-08-16
7757926 Transducer assembly for a bonding apparatus Chi Po Chong, Wing Fai Lam 2010-07-20
7458495 Flip chip bonding tool Ran Fu, Deming Liu, Chi Chuen Chaw, Chak Hau Pang, Hing Suen Siu 2008-12-02
7100812 Capillary holder Bao Nian Zhai, Ka Shing Kenny Kwan, Man Chan, Chi Po Chong, Yam Mo Wong 2006-09-05
7002283 Ultrasonic transducer assembly Kin Yik Hung, Ming Wai Kelvin Ng 2006-02-21
6871770 Ultrasonic transducer Kelvin NG, Helen Lai Wa Chan, Peter Liu 2005-03-29
6597084 Ring-shaped piezoelectric transformer having an inner and outer electrode Jin-Hua Hu, Helan Lai-Wah Chan, Chung Loong Choy 2003-07-22
5942838 Rotary motor driven by a piezoelectric composite laminate Shi-Wei Lee 1999-08-24