Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7458495 | Flip chip bonding tool | Ran Fu, Deming Liu, Hing Leung Li, Chak Hau Pang, Hing Suen Siu | 2008-12-02 |
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices | Jianxiong Li, Ngai Kin Tsui, Deming Liu, Yiu Fai Kwan, Wai Chan | 2008-02-12 |