Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475666 | Routable electroforming substrate comprising removable carrier | Tat Chi Chan, Gio Jose Asumo Villaespin, Yu Lung LAM, Hang Ren | 2019-11-12 |
| 9847468 | Plated lead frame including doped silver layer | Yu Lung LAM, Ching Man Tsui, Ho Ki Yeung | 2017-12-19 |
| 8012886 | Leadframe treatment for enhancing adhesion of encapsulant thereto | Tat Chi Chan, Wai Chan, Chi Chung Lee | 2011-09-06 |
| 7691679 | Pre-plated leadframe having enhanced encapsulation adhesion | Tat Chi Chan, Chun Ho Yau, Chi Chung Lee | 2010-04-06 |
| 7462926 | Leadframe comprising tin plating or an intermetallic layer formed therefrom | Ran Fu, Deming Liu | 2008-12-09 |
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices | Jianxiong Li, Chi Chuen Chaw, Ngai Kin Tsui, Deming Liu, Wai Chan | 2008-02-12 |
| 7125750 | Leadframe with enhanced encapsulation adhesion | Wai Chan | 2006-10-24 |