Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012886 | Leadframe treatment for enhancing adhesion of encapsulant thereto | Yiu Fai Kwan, Tat Chi Chan, Wai Chan | 2011-09-06 |
| 7691679 | Pre-plated leadframe having enhanced encapsulation adhesion | Yiu Fai Kwan, Tat Chi Chan, Chun Ho Yau | 2010-04-06 |
| 6274010 | Electroplating apparatus | Paul Henington, Chun Pan Fung, Kwok Wah Li | 2001-08-14 |
| 6251234 | Electroplating machine | Paul Henington, Kwok Wah Li, Kwok Wing Ng, Pin-Chun Huang, Fang Hao Lee +2 more | 2001-06-26 |
| 6174417 | Electroplating machine | Paul Henington, Kwok Wah Li, Kwok Wing Ng, Pin-Chun Huang, Fang Hao Lee +2 more | 2001-01-16 |