Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475666 | Routable electroforming substrate comprising removable carrier | Yiu Fai Kwan, Gio Jose Asumo Villaespin, Yu Lung LAM, Hang Ren | 2019-11-12 |
| 8012886 | Leadframe treatment for enhancing adhesion of encapsulant thereto | Yiu Fai Kwan, Wai Chan, Chi Chung Lee | 2011-09-06 |
| 7691679 | Pre-plated leadframe having enhanced encapsulation adhesion | Yiu Fai Kwan, Chun Ho Yau, Chi Chung Lee | 2010-04-06 |