Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475666 | Routable electroforming substrate comprising removable carrier | Tat Chi Chan, Yiu Fai Kwan, Gio Jose Asumo Villaespin, Hang Ren | 2019-11-12 |
| 9847468 | Plated lead frame including doped silver layer | Yiu Fai Kwan, Ching Man Tsui, Ho Ki Yeung | 2017-12-19 |