Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475763 | Die bonding apparatus comprising an inert gas environment | Siu Wing LAU, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go | 2019-11-12 |
| 9281290 | Bond head for thermal compression die bonding | Pak Kin Leung, Cheuk Wah Tang, Chi Ping Hung, Gary Peter Widdowson | 2016-03-08 |
| 8857486 | Flip arm module for a bonding apparatus incorporating changeable collet tools | Chi Fung Michael Chan | 2014-10-14 |
| 7667355 | Apparatus for generating amplified cooling air flows | Yuk Cheung Au, Wing Chiu Lai, Pak Kin Leung, Cheuk Wah Tang, Wai (Kan Wae) Lam | 2010-02-23 |
| 7402778 | Oven for controlled heating of compounds at varying temperatures | Srikanth Narasimalu, Wei Ling Chan, Man Wai Chan, Cheuk Wah Tang, Kai Wu | 2008-07-22 |
| 7002283 | Ultrasonic transducer assembly | Hing Leung Li, Ming Wai Kelvin Ng | 2006-02-21 |