Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475763 | Die bonding apparatus comprising an inert gas environment | Siu Wing LAU, Kin Yik Hung, Yuk Cheung Au, Leo Man Lee, Sai Yuen Go | 2019-11-12 |
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Kin Fung Yu +1 more | 2019-06-04 |
| 10192761 | Pick arm comprising a winged part for a bonding apparatus | Kin Fung Yu, Yu Xing Cao, Kai Siu LAM, Gary Peter Widdowson, Ying Zhuo Liu | 2019-01-29 |
| 7667355 | Apparatus for generating amplified cooling air flows | Yuk Cheung Au, Kin Yik Hung, Pak Kin Leung, Cheuk Wah Tang, Wai (Kan Wae) Lam | 2010-02-23 |
| 7514825 | Linear motor cooling apparatus with air amplification | Cheuk Wah Tang, Yen Hsi Tang, Ming Lok Yeung | 2009-04-07 |