Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192847 | Rapid cooling system for a bond head heater | Lu Ma, Pak Kin Leung | 2019-01-29 |
| 9281290 | Bond head for thermal compression die bonding | Kin Yik Hung, Pak Kin Leung, Chi Ping Hung, Gary Peter Widdowson | 2016-03-08 |
| 8324848 | System for maintaining thermal stability of a motion stage | Gary Peter Widdowson, Wai Chuen Gan, Chor Fai Wong | 2012-12-04 |
| 7667355 | Apparatus for generating amplified cooling air flows | Yuk Cheung Au, Kin Yik Hung, Wing Chiu Lai, Pak Kin Leung, Wai (Kan Wae) Lam | 2010-02-23 |
| 7514825 | Linear motor cooling apparatus with air amplification | Wing Chiu Lai, Yen Hsi Tang, Ming Lok Yeung | 2009-04-07 |
| 7402778 | Oven for controlled heating of compounds at varying temperatures | Kin Yik Hung, Srikanth Narasimalu, Wei Ling Chan, Man Wai Chan, Kai Wu | 2008-07-22 |