Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475763 | Die bonding apparatus comprising an inert gas environment | Siu Wing LAU, Kin Yik Hung, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go | 2019-11-12 |
| 8470130 | Universal die detachment apparatus | Chi Ming Chong, Jin Hui Meng, Man Wai Chan | 2013-06-25 |
| 8141612 | Device for thin die detachment and pick-up | Man Wai Chan, Kwok Wai Wong, Chi Ming Chong | 2012-03-27 |
| 7667355 | Apparatus for generating amplified cooling air flows | Kin Yik Hung, Wing Chiu Lai, Pak Kin Leung, Cheuk Wah Tang, Wai (Kan Wae) Lam | 2010-02-23 |
| 7240711 | Apparatus and method for alignment of a bonding tool | Lai Wa Helen Chan, Siu Hong Choy, Chou Kee Peter Liu, Ming Wai Kelvin Ng | 2007-07-10 |
| 6543513 | Wafer table for die bonding apparatus | Siu Wing LAU | 2003-04-08 |
| 6367669 | Fluid dispensing apparatus | Man Wai Chan | 2002-04-09 |