Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475763 | Die bonding apparatus comprising an inert gas environment | Kin Yik Hung, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go | 2019-11-12 |
| 8633441 | Die bonding process incorporating infrared vision system | Ran Wang, Wing Hong Leung | 2014-01-21 |
| 7830597 | Optical system having selectable field for inspection | Zhuan Yun Zhang, Yiu Ming Cheung, Chi Ping Hung | 2010-11-09 |
| 6543513 | Wafer table for die bonding apparatus | Yuk Cheung Au | 2003-04-08 |