Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776930 | Die bond head apparatus with die holder motion table | Chung Sheung Yung | 2023-10-03 |
| 10622329 | Bond head cooling apparatus | Yi Kei Law, Chuek Wah Tang, Gary Peter Widdowson | 2020-04-14 |
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Chuek Wah Tang, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu +1 more | 2019-06-04 |
| 10192847 | Rapid cooling system for a bond head heater | Lu Ma, Cheuk Wah Tang | 2019-01-29 |
| 9281290 | Bond head for thermal compression die bonding | Kin Yik Hung, Cheuk Wah Tang, Chi Ping Hung, Gary Peter Widdowson | 2016-03-08 |
| 7667355 | Apparatus for generating amplified cooling air flows | Yuk Cheung Au, Kin Yik Hung, Wing Chiu Lai, Cheuk Wah Tang, Wai (Kan Wae) Lam | 2010-02-23 |