Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776930 | Die bond head apparatus with die holder motion table | Pak Kin Leung | 2023-10-03 |
| 10861819 | High-precision bond head positioning method and apparatus | Jiangwen Deng, Wui Fung Sze | 2020-12-08 |
| 8875979 | Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck | Chi Ming Chong, Gary Peter Widdowson | 2014-11-04 |
| 8733539 | Vibratory feeder for conveying components | Ping Kong Choy, Ho Chi Wong, Chung Yin Lau | 2014-05-27 |
| 8387851 | Apparatus for aligning a bonding tool of a die bonder | Shing Lui Lau, Chi Ming Chong, Gary Peter Widdowson | 2013-03-05 |
| 8256103 | Actuator for maintaining alignment of die detachment tools | Ping Kong Choy, Hon Yu Peter Ng | 2012-09-04 |
| 7849896 | Bondhead alignment tool for a bonding apparatus | Ping Kong Choy, Ju-Yu Fan, Hon Yu Peter Ng | 2010-12-14 |
| 7845543 | Apparatus and method for bonding multiple dice | Ping Kong Choy, Hon Yu Peter Ng | 2010-12-07 |
| 7649333 | Active damping device for a positioning stage | Ping Kong Choy, Siu Wing Or, Chou Kee Peter Liu, Lai Wa Helen Chan-Wong | 2010-01-19 |
| 7462960 | Driver for an ultrasonic transducer and an ultrasonic transducer | Siu Wing Or, Helen Lai Wa Chan-Wong | 2008-12-09 |