Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622329 | Bond head cooling apparatus | Yi Kei Law, Pak Kin Leung, Gary Peter Widdowson | 2020-04-14 |
| 10312214 | Atomization mechanism for cooling a bond head | Yi Kei Law, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu +1 more | 2019-06-04 |