Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347813 | Semiconductor package and related methods | Chee Hiong CHEW, Vemmond Jeng Hung NG, Shutesh Krishnan | 2025-07-01 |
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Shutesh Krishnan, Francis J. Carney | 2024-12-17 |
| 12160060 | Bonding module pins to an electronic substrate | Dennis Cadiz YBORDE, Shutesh Krishnan, Pui Leng LOW | 2024-12-03 |
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Vemmond Jeng Hung NG, Shutesh Krishnan | 2023-11-28 |
| 11791288 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR | 2023-10-17 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Shutesh Krishnan, Francis J. Carney | 2023-10-03 |
| 11626677 | Bonding module pins to an electronic substrate | Dennis Cadiz YBORDE, Shutesh Krishnan, Pui Leng LOW | 2023-04-11 |
| 11348878 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR | 2022-05-31 |
| 10700018 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR | 2020-06-30 |
| 10546798 | Direct bonded copper semiconductor packages and related methods | Vernal Raja Manikam, Azhar Aripin | 2020-01-28 |
| 9991185 | Direct bonded copper semiconductor packages and related methods | Vemal Raja Manikam, Azhair Aripin | 2018-06-05 |
| 9659837 | Direct bonded copper semiconductor packages and related methods | Vemal Raja Manikam, Azhar Aripin | 2017-05-23 |