Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402264 | Stacked power terminals in a power electronics module | Yushuang YAO, Chee Hiong CHEW | 2025-08-26 |
| 12347813 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Shutesh Krishnan | 2025-07-01 |
| 12300558 | Substrates and related methods | Atapol Prajuckamol, Chee Hiong CHEW, Yushuang YAO | 2025-05-13 |
| 12283562 | Clip design and method of controlling clip position | Atapol Prajuckamol, Chee Hiong CHEW | 2025-04-22 |
| 12131981 | Power module package baseplate with step recess design | Yushuang YAO | 2024-10-29 |
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Shutesh Krishnan | 2023-11-28 |
| 11735504 | Power module package baseplate with step recess design | Yushuang YAO | 2023-08-22 |
| 11482468 | Power module package casing with protrusion supports | Yushuang YAO, Chee Hiong CHEW, Qing Yang | 2022-10-25 |