Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391762 | Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same | Daniel Gamota, Robert Kenneth Doot | 2002-05-21 |
| 6093972 | Microelectronic package including a polymer encapsulated die | Francis J. Carney, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman +3 more | 2000-07-25 |
| 6049463 | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same | Grace M. O'Malley, Lillian C. Thompson, Iwona Turlik | 2000-04-11 |
| 5895229 | Microelectronic package including a polymer encapsulated die, and method for forming same | Francis J. Carney, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman +3 more | 1999-04-20 |
| 5895976 | Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same | Michelle J. Morrell, Steven C. Machuga, Grace M. O'Malley, Andrew Skipor, Wen Xu Zhou +1 more | 1999-04-20 |
| 5844319 | Microelectronic assembly with collar surrounding integrated circuit component on a substrate | Danniel Roman Gamota, Sean Xin Wu, Brian J. Bullock | 1998-12-01 |