Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5895976 | Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same | Michelle J. Morrell, Grace M. O'Malley, George Amos Carson, Andrew Skipor, Wen Xu Zhou +1 more | 1999-04-20 |
| 5523920 | Printed circuit board comprising elevated bond pads | Janice M. Giesler, Grace M. O'Malley, Charles McPherson | 1996-06-04 |
| 5137846 | Method for forming a polycyanurate encapsulant | Robert W. Pennisi, Stephanie Schauer | 1992-08-11 |
| 5120678 | Electrical component package comprising polymer-reinforced solder bump interconnection | Kevin D. Moore, John W. Stafford, Kenneth Cholewczynski, Dennis Brian Miller | 1992-06-09 |