Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and laminated leadframe package

Semiconductor device and laminated leadframe package

US Patent 6768186 · Granted Jul 27, 2004

Estimated economic value: $14,519,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structures and methods of manufacture2024
Semiconductor package structures and methods of manufacture2023
Semiconductor package structures and methods of manufacture2022
Methods of forming leadless semiconductor packages with plated leadframes and we2021
Semiconductor packages2021
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Damaging components with defective electrical couplings2020
Single or multi chip module package and related methods2019
Semiconductor packages with leadframes and related methods2019
Wafer level flat no-lead semiconductor packages and methods of manufacture2019