Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Single or multi chip module package and related methods

Single or multi chip module package and related methods

US Patent 9870986 · Granted Jan 16, 2018

Estimated economic value: $23,010,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Orthopaedic systems, transfer guide assemblies, and methods of repair2025
Structure and method related to a power module using a hybrid spacer2025
Structure and method related to a power module using a hybrid spacer2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Semiconductor package structures and methods of manufacture2024
Semiconductor package structures and methods of manufacture2024
Semiconductor package structures and methods of manufacture2024
Low stress asymmetric dual side module2024
Low stress asymmetric dual side module2024