Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9911684 | Holes and dimples to control solder flow | Dennis Lee Conner, Jay A. Yoder | 2018-03-06 |
| 9870986 | Single or multi chip module package and related methods | Roger M. Arbuthnot, Jay A. Yoder, Dennis Lee Conner | 2018-01-16 |
| 9773895 | Half-bridge HEMT circuit and an electronic package including the circuit | Balaji Padmanabhan, Prasad Venkatraman, Peter Moens, Mihir Mudholkar, Joe Fulton +5 more | 2017-09-26 |
| 9646919 | Semiconductor package for a lateral device and related methods | Roger M. Arbuthnot, Peter Moens | 2017-05-09 |
| 9576883 | Semiconductor devices and methods of making the same | Roger M. Arbuthnot | 2017-02-21 |
| 9558968 | Single or multi chip module package and related methods | Roger M. Arbuthnot, Jay A. Yoder, Dennis Lee Conner | 2017-01-31 |
| 9397028 | Semiconductor devices and methods of making the same | Roger M. Arbuthnot | 2016-07-19 |
| 9379193 | Semiconductor package for a lateral device and related methods | Roger M. Arbuthnot, Peter Moens | 2016-06-28 |
| 9070721 | Semiconductor devices and methods of making the same | Roger M. Arbuthnot | 2015-06-30 |
| 8384206 | Semiconductor package | Roger M. Arbuthnot, Frank Tim Jones | 2013-02-26 |
| 8253239 | Multi-chip semiconductor connector | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2012-08-28 |
| 7935575 | Method of forming a semiconductor package and structure therefor | Roger M. Arbuthnot, Frank Tim Jones | 2011-05-03 |
| 7875964 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2011-01-25 |
| 7566967 | Semiconductor package structure for vertical mount and method | Francis J. Carney, Bruce Alan Huing | 2009-07-28 |
| 7498195 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2009-03-03 |
| 7495323 | Semiconductor package structure having multiple heat dissipation paths and method of manufacture | Phillip Celaya, Roger M. Arbuthnot, Francis J. Carney | 2009-02-24 |
| 7476959 | Encapsulated electronic device | Michael J. Seddon | 2009-01-13 |
| 7397120 | Semiconductor package structure for vertical mount and method | Francis J. Carney, Bruce Alan Huling | 2008-07-08 |
| 7319266 | Encapsulated electronic device structure | Michael J. Seddon | 2008-01-15 |
| 7298034 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2007-11-20 |
| 7202105 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2007-04-10 |
| 7202106 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2007-04-10 |
| 7180170 | Lead-free integrated circuit package structure | Phillip Celaya, James S. Donley | 2007-02-20 |
| 7135761 | Robust power semiconductor package | Francis J. Carney, Jeffrey Pearse | 2006-11-14 |
| 6889429 | Method of making a lead-free integrated circuit package | Phillip Celaya, James S. Donley | 2005-05-10 |