Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5194137 | Solder plate reflow method for forming solder-bumped terminals | Kevin D. Moore, John W. Stafford, William M. Beckenbaugh | 1993-03-16 |
| 5160409 | Solder plate reflow method for forming a solder bump on a circuit trace intersection | Kevin D. Moore, John W. Stafford, William M. Beckenbaugh | 1992-11-03 |