Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5120678 | Electrical component package comprising polymer-reinforced solder bump interconnection | Steven C. Machuga, John W. Stafford, Kenneth Cholewczynski, Dennis Brian Miller | 1992-06-09 |
| 4827326 | Integrated circuit having polyimide/metal passivation layer and method of manufacture using metal lift-off | Leonard F. Altman, John D. Shurboff | 1989-05-02 |