Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5346857 | Method for forming a flip-chip bond from a gold-tin eutectic | Russell T. Lee, Ravichandran Subrahmanyan | 1994-09-13 |
| 5072873 | Device for solder removal | Jay Liu, William H. Lytle | 1991-12-17 |
| 4609936 | Semiconductor chip with direct-bonded external leadframe | Vern H. Winchell, II | 1986-09-02 |
| 4394678 | Elevated edge-protected bonding pedestals for semiconductor devices | Vern H. Winchell, II, Lowell E. Clark | 1983-07-19 |