Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5886362 | Method of reflowing solder bumps after probe test | Lavoie R. Millican | 1999-03-23 |
| 5164885 | Electronic package having a non-oxide ceramic bonded to metal and method for making | James E. Drye, David Reed | 1992-11-17 |
| 4722914 | Method of making a high density IC module assembly | James E. Drye, Jack A. Schroeder | 1988-02-02 |
| 4630096 | High density IC module assembly | James E. Drye, Jack A. Schroeder | 1986-12-16 |
| 4609936 | Semiconductor chip with direct-bonded external leadframe | Thomas A. Scharr | 1986-09-02 |
| 4394678 | Elevated edge-protected bonding pedestals for semiconductor devices | Thomas A. Scharr, Lowell E. Clark | 1983-07-19 |