| 5742100 |
Structure having flip-chip connected substrates |
Conrad S. Monroe |
1998-04-21 |
| 4933741 |
Multifunction ground plane |
— |
1990-06-12 |
| 4933747 |
Interconnect and cooling system for a semiconductor device |
— |
1990-06-12 |
| 4805007 |
Flip chip module |
— |
1989-02-14 |
| 4722914 |
Method of making a high density IC module assembly |
James E. Drye, Vern H. Winchell, II |
1988-02-02 |
| 4630096 |
High density IC module assembly |
James E. Drye, Vern H. Winchell, II |
1986-12-16 |
| 4613670 |
Group IVB metal containing polydyes |
Charles E. Carraher, Jr., Richard A. Schwarz |
1986-09-23 |
| 4513355 |
Metallization and bonding means and method for VLSI packages |
Ernel R. Winkler |
1985-04-23 |
| 4312981 |
Modified cellulosic products having enhanced thermal, solvent, and biological properties |
Charles E. Carraher, Jr., David J. Giron, Christy A. McNeely |
1982-01-26 |
