Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7434310 | Process to reform a plastic packaged integrated circuit die | Bruce C. Deemer, Daniel T. Rooney | 2008-10-14 |
| 7390978 | Overmolded electronic assembly and overmoldable interface component | Daniel T. Rooney, Jeffrey M. Petsinger | 2008-06-24 |
| 7241510 | Peelable circuit board foil | Gregory J. Dunn, Remy J. Chelini | 2007-07-10 |
| 7193838 | Printed circuit dielectric foil and embedded capacitors | Gregory J. Dunn, Remy J. Chilini, Robert T. Croswell, Claudia V. Gamboa, Jovica Savic | 2007-03-20 |
| 7078796 | Corrosion-resistant copper bond pad and integrated device | Gregory J. Dunn, Owen R. Fay, Terance B. Blake, Remy J. Chelini, William H. Lytle +1 more | 2006-07-18 |
| 6974776 | Activation plate for electroless and immersion plating of integrated circuits | William H. Lytle | 2005-12-13 |
| 6872468 | Peelable circuit board foil | Gregory J. Dunn, Remy J. Chelini, Claudia V. Gamboa | 2005-03-29 |