Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5369304 | Conductive diffusion barrier of titanium nitride in ohmic contact with a plurality of doped layers therefor | Israel A. Lesk, Francine Y. Robb, Lewis E. Terry | 1994-11-29 |
| 5323059 | Vertical current flow semiconductor device utilizing wafer bonding | Robert E. Rutter | 1994-06-21 |
| 5314107 | Automated method for joining wafers | Raymond C. Wells, Sherry L. F. Helsel | 1994-05-24 |
| 5268326 | Method of making dielectric and conductive isolated island | Israel A. Lesk, Francine Y. Robb, Raymond C. Wells | 1993-12-07 |
| 5256581 | Silicon film with improved thickness control | Juergen A. Foerstner, Henry G. Hughes | 1993-10-26 |
| 5183769 | Vertical current flow semiconductor device utilizing wafer bonding | Robert E. Rutter | 1993-02-02 |
| 5141887 | Low voltage, deep junction device and method | Hang M. Liaw, Raymond M. Roop, Dennis R. Olsen | 1992-08-25 |
| 5131968 | Gradient chuck method for wafer bonding employing a convex pressure | Raymond C. Wells | 1992-07-21 |
| 4849371 | Monocrystalline semiconductor buried layers for electrical contacts to semiconductor devices | Kent W. Hansen, Hang M. Liaw | 1989-07-18 |
| 4818323 | Method of making a void free wafer via vacuum lamination | Hang M. Liaw | 1989-04-04 |